3Brain

3Brain

Zug, Switzerland· Est.
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Private Company

Total funding raised: $53.2M

Overview

Founded in 2010, 3Brain is a pioneer in merging microelectronics with biology to revolutionize in vitro electrophysiology. Its flagship CorePlate™ technology embeds a custom BioSignal Processing Unit (BioSPU) into each culture well, enabling unprecedented parallel, real-time recording and stimulation of thousands of electrodes for studying neuronal networks, brain organoids, and other electrogenic cells. With over two decades of scientific heritage, headquarters near Zürich, and operations in Italy and the US, the company aims to accelerate neuroscience research and pharmaceutical screening by providing superior spatial and temporal resolution compared to traditional methods.

NeuroscienceCardiology

Technology Platform

CorePlate™ technology integrates a custom CMOS BioSignal Processing Unit (BioSPU) into cell culture plates, creating high-density microelectrode arrays (HD-MEAs) for real-time, bidirectional, label-free electrophysiological recording and stimulation of 2D and 3D cellular networks.

Funding History

4
Total raised:$53.2M
Series B$30M
Series A$10M
Series A$12M
Seed$1.2M

Opportunities

Significant growth opportunities exist in penetrating the pharmaceutical industry's high-throughput screening workflows with the 96-well HyperCAM platform, and in capitalizing on the rapid adoption of complex 3D models like brain organoids with the unique CorePlate™ 3D technology.
Expansion of the US commercial base provides direct access to a large research market.

Risk Factors

Key risks include the challenge of displacing established, often simpler research methods, competition from larger life science tool conglomerates, the high complexity and cost of the deep-tech platform, and dependency on recurring consumable sales in a niche, capital-intensive research market.

Competitive Landscape

3Brain competes with established MEA providers like Axion BioSystems and Multi Channel Systems MCS. Its main differentiation lies in its deep-tech CMOS integration, offering superior electrode density, real-time on-chip processing, true 3D electrode access, and scalable high-throughput formats, positioning it as a premium technology provider for high-content functional analysis.